国外微电子期刊

是的。IEEEElectronDeviceLetters是国际微电子器件领域的顶级期刊，也是IEEEElectronDevicesSociety第一旗舰期刊，在国际微电子领域享有权威的学术地位和广泛的影响力。郝跃院士团队2018年在该期刊发表学术论文十多篇，标志着西安电子科技大学在先进微电子器件研究领域已经走在世界前列。

期刊名 microelectronics journal 出版周期: 月刊 微电子方向，这期刊不错了，under review看你审稿人快否，一般1~3个月都有可能。 出版社或管理机构 杂志由 ELSEVIER SCI LTD 出版或管理。 ISSN号：0026-2692 杂志简介/稿件收录要求 Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on semiconductor technology. Coverage of the journal falls into the two main categories of Circuits and Systems and Physics and Devices. The journal invites research and application papers in all the areas listed below. Papers featuring novel system designs or devices are especially welcomed. The journal also considers comprehensive review/survey papers covering recent developments. The journal's coverage includes, but is not limited to: Circuits and Systems Analogue, digital and RF circuit design methodologies Logic, architectural and system level synthesis Testing, design for testability, built in self-test Area, power and thermal evaluation Co-design, including hardware-software and chip-package Mixed-domain simulation and design Formal verification Application aspects such as signal and image processing, sensor and actuator design, reliability and quality issues, and economic models, are also welcome. Physics and Devices Materials growth science: technology and techniques Physics, properties and characterisation of materials systems Devices and microsystems technology: production and manufacturing Advanced lithography for submicron devices and VLSI microlithography Nanoelectronics and nanoprecision instrumentation Technology and applications of magnetic materials Molecular engineering: molecular materials and self-assembly processes Devices covered include semiconductor devices, optoelectronic devices, micromachined devices, nanodevices and hybrid devices. Papers covering the associated materials, physics, properties, fabrication and manufacturing of these devices are also welcomed. Journal homepages: